DIO News

DIO. unveils full digital workflow lineup for the first time at YESDEX 2020

Korea 18 Nov, 2020

'DIO PROBO Z' box office preview, excited the dental 3D printing market
DIO. (CEO Jin-baek Kim), a leading company in digital dentistry presented a number of new products at the Yeongnam International Dental Science Conference and Equipment Exhibition (hereinafter referred to as YESDEX 2020) held at the Gyeongju Hwabaek Convention Center on the 14th and 15th.
At this exhibition, DIO. has unveiled a full digital workflow line-up of innovative technologies in digital dental care for the first time. With new products such as “DIO PROBO Z” a 3D printer for prosthetic production and “UF(Ⅱ) Short Implant”, and together they completed a full digital workflow, capturing the attention of visitors.
In particular, ‘DIO PROBO Z', which is expected to be released in the first half of next year, is a 3D printer optimized for digital prosthesis production. If the final prostheses are printed with the advanced new material 'DIOnavi-C&B Z', they can be printed faster and will give a more precise result. Additionally, the transparent guide material 'DIOnavi-SG02', which has improved treatment accuracy than existing materials with its superior transparency, was also exhibited and was praised for securing technology that will lead the innovation in the dental 3D printing market.

Also, at the DIO digital calibration booth, the inquiries had poured in about the newly released transparent calibration device 'DIO Ortho navi. Clear Aligner'. Besides, various attractions were provided to visitors, such as the oral scanner Trios 4 and the VR experience zone.
DIO.’s Marketing Team Manager Mr. Yong-young Lee said, “Even in a situation where the exhibition industry market had been reduced due to Corona 19, we were able to successfully hold the exhibition with everyone’s interest in DIO’s innovative new products.” And he made a pledge, by saying that “We will focus all our capabilities not only on providing our products but also our worthy innovation to everyone.”
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